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Structalit® 5894-1
Resine d'encapulation

New Potting Compound With Excellent Flow Properties


Eleco launches a new potting compound with medium viscosity and small filler particle size: Structalit® 5894-1 is the perfect choice for large-volume potting or glob top sealing of power electronics.

Structalit® 5894-1 is a one-component, black epoxy resin. During application it features optimum flow properties, due to its combination of optimized viscosity and small particle size of fillers. As an additional benefit, the low filler weight makes Structalit® 5894-1 less abrasive during application.

Structalit® 5894-1 cures rapidly when exposed to heat, which allows faster processing of large-volume electronic component potting and sealing. Once cured, the compound provides a smooth and level surface which is at the same time shock- and scratch-resistant.

 

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Underfiller noire Structalit® 8202
Underfill noire

New black epoxy underfiller

Eleco added a new epoxy-based underfiller from Panacol to their portfolio. Structalit® 8202 is a low viscosity one-part adhesive with a high capillary flow filling the narrowest gaps. 
 
Structalit® 8202 is a high performance underfill material designed for chip stack packages and BGA. It is a one part, black colored epoxy with low viscosity which flows into the narrowest gaps. Special features of this product are its low coefficient of thermal expansion and high glass transition temperature. This makes Structalit® 8202 stable at high temperatures, allowing usage in reflow processes.  
 
Structalit® 8202 cures rapidly under the influence of heat. The underfiller can also be cured during reflow processes. Due to its very good compatibility with most leadfree solders the adhesive cures completely even if it gets into contact with residues from flux agents. 
 
Once cured, the material provides excellent mechanical properties to protect solder joints during thermal cycling. Structalit® 8202 is RoHS compliant and meets electronic grade standards (less than 900ppm Cl-).


Vitralit® UV 4802 est très flexible
Coller plastique et coller PEEK

New, flexible adhesive for PEEK

Eleco has launched an extremely flexible adhesive, which adheres particularly well to hard to bond plastics including PEEK: Vitralit® UV 4802 is a one-component acrylic system that cures very fast when exposed to light.

Vitralit® UV 4802 is a light curing adhesive based on acrylate resin, which features excellent adhesion to many plastics such as PEEK, PEN and TPU, that are typically hard to bond with conventional adhesives. This adhesive also adheres very well to ceramics and glass. Vitralit® UV 4802 is highly resistant to heat: tests have shown that the adhesive keeps its soft and flexible characteristics even after being exposed to temperatures of 150°C for seven days. Thanks to its high flexibility the adhesive is perfectly suited for bonding thin and bendable materials.

Vitralit® UV 4802 is of pink colour and cures within seconds under a UV or visible light source. Both gas discharge lamps and LEDs like the LED SPOT 100 from Hoenle are suitable for curing. Once cured, the adhesive fluoresces which enables inspection of the bondline under black light.


Colle Penloc GTN
Colle Penloc GTN

New low-odour high-performance adhesive 

Eleco has a new two-component high-performance structural adhesive in its product range: Penloc® GTN is an easy to process methyl acrylate based low-odour adhesive that can be used in a wide variety of applications.

Penloc® GTN adheres especially well to brass, ceramics, steel, aluminium, PVC and similar materials. The performance adhesive boasts a high power transmission capability and excellent thermal stability. It is both flexible and offers superior adhesion. Compared to other methyl acrylate adhesives, it has the advantages of a low odour formation and a long processing time of ten to 15 minutes.

To allow effective monitoring of blending quality, the two components of Penloc® GTN have different colours that, applied thinly, change to a grey, almost colourless surface as the blend cures. Penloc® GTN can be conveniently dispensed from a handy 50 ml double cartridge or from drums connected to dispensing apparatus.

 

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Structalit® 8801

New Medical Grade Epoxy Adhesive

Eleco adds epoxy-based adhesive Structalit® 8801 to its portfolio of medical grade adhesives. The biocompatible adhesive was specially designed for bonding temperature-sensitive substrates as it cures quickly at low temperatures.

Structalit® 8801 is a single-component adhesive based on epoxy resin. Due to its viscosity characteristics it is perfectly suited as a potting or filling material. The beige-coloured adhesive possesses high chemical resistance against common cleaning agents used for medical devices, including isopropyl alcohol. It develops high bond strength with ceramics, metals and many plastics. For example, Structalit® 8801 is successfully being used as a potting compound for sensors in medtech devices.

Structalit® 8801 cures very quickly at low oven temperatures. At 100°C this adhesive will fully cure in only a few minutes.

For applications in medical devices Structalit® 8801 is certified according to ISO 10993-5 standards. The adhesive is 100% solvent free and compatible with common sterilization processes such as autoclaving, gamma irradiation, E-beam and EtO. 

 

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Structalit® 5610
Structalit® 5610

New super-fast curing SMD adhesive


Specially designed for attaching SMDs on circuit boards, Eleco launches newly developed fast curing epoxy adhesive Structalit® 5610. Due to its high viscosity the adhesive is well-suited for screen printing. The new adhesive will be first shown at this years’s Productronica in Munich.

Structalit® 5610 is a red-colored epoxy adhesive which makes a perfect contrast to green circuit boards. The one-component adhesive is easily applied via dispenser, screen printing or needle transfer.

The SMD adhesive cures thermally within minutes, even at low temperatures. At the same time it is highly temperature-resistant: Temporarily it can be exposed to temperatures up to 280° C, making it the perfect adhesive for reflow soldering.

Once cured, Structalit® 5610 is extremely shock-resistant and features very high adhesion to FR4 circuit boards, to metals and to epoxy-based mold materials.

 

Download press release (pdf, en anglais)


Structalit® 8801 T

New structural adhesive cures at low temperatures

Eleco introduces newly developed structural adhesive Structalit® 8801 T, which cures rapidly at low temperatures. The epoxy adhesive was specially formulated for temperature-sensitive applications in electronics, as well as automotive and aerospace industries.
    
Structalit® 8801 T is an all-purpose beige-colored single-component epoxy adhesive. It is ideally suited for potting applications in electronic components. Its excellent chemical resistance against oils and fuels makes it the perfect choice for bonding applications in the automotive and aerospace industry. Structalit® 8801 T has been successfully used in applications where strong resistance to hot kerosene and brake fluids was needed.

Due to its shear thinning properties Structalit® 8801 T offers improved flow control and the ability for precise dispensing on components surfaces. This adhesive develops high bond strength on ceramics, metals and many plastics.

Structalit® 8801 T cures very quickly at low oven temperatures. At 100°C this adhesive will fully cure in only a few minutes. Induction curing processes can be used to cure Structalit® 8801 T on ferromagnetic substances.

 

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Vitralit® UD 8050
Collage de composants

New Glob Top adhesives

Specially for the consumer and general electronics industry, Eleco introduces two new adhesives with a low halogen content from Panacol: Vitralit® UD 8050 and Structalit® 8838 provide encapsulation of electronic components on PCBs.

Vitralit® UD 8050 is an acrylic-based one-component adhesive which, thanks to its easy dispensing ability and rapid curing, is especially suitable for use in the consumer electronics sector, in which a high throughput is necessary.
 
Exposed to UV light, Vitralit® UD 8050 cures within seconds. Being dual UV and moisture curing, Vitralit® UD 8050 will also fully cure in shadowed areas not reached by the UV light, thereby increasing the performance of the hardened adhesive. For enhanced process control, a version with fluorescent marker is also available.   

Structalit® 8838 is a black epoxy-based one-component adhesive. Its key characteristics are a low glass transition temperature, good flexibility and fast thermal curing. Once cured, Structalit® 8838 is the perfect solution for flexible encapsulation of electronic components. Temperature and moisture tests have proved that the adhesive does not impair the properties of individual components.

Both Vitralit® UD 8050 and Structalit® 8838 allow better flow control and precise dispensing on individual components due to their intrinsic viscosity. Both of these adhesives are compatible with fluxing agent and can therefore ensure full, effective curing on electronic components. With a low halogen content, they fulfil international electronic grade standards regarding corrosion prevention of electronic components.


Vitralit® VBB-2N LV
collage de gomme

New UV-adhesive for elastomeric bonds

Eleco presents a new solvent free UV-adhesive. Vitralit® VBB-2N LV from Panacol features low viscosity and is ideally suited for bonding elastomeric materials.
   
Due to its extremely low viscosity Vitralit® VBB-2N LV is suitable for large area bonding as well as applications where the gap size is very small. When cured, it demonstrates excellent flexibility and environmental stability. Vitralit® VBB-2N LV is a solvent-free transparent adhesive and provides very good adhesion to most elastomeric materials like TPE (Thermal Plastic Elastomer) and rubber (natural rubber latex, NBR, SBR etc).

If at least one assembly material is transparent, Vitralit® VBB-2N LV cures in seconds with UV-A light to produce a strong and reliable bond. UV-blocking materials like polycarbonate can be cured due to the adhesive’s ability to cure with visible light (>400nm). Both gas discharge lamps and LEDs are suitable for curing. Excellent curing results were achieved with the 405nm Blue Point LED light from Dr. Hoenle AG.

For use in medical applications Eleco can provide an alternative product with similar properties that meets the requirements for USP Class VI and is compatible with sterilization by autoclaving, gamma irradiation and EtO.

 

 

 

 

 


Vitralit® 7311
Needle Bonding

New plastic adhesive with multiple viscosity options

Eleco introduces a newly developed UV adhesive, which is specially formulated by Panacol for bonding plastics and will be available in three different viscosities.
   
The appropriate viscosity can be chosen depending on the application: Vitralit® 7311 is extremely low viscosity and thus the perfect choice for very tight bond gaps.  Vitralit® 7311 T is a mid-range viscosity version, and Vitralit® 7311 Gel features high viscosity, non-flowing properties.

All three variations of Vitralit® 7311 provide excellent adhesion to most plastics like PC, PVC and PMMA, as well as to metal and glass. Vitralit® 7311 is transparent and non-yellowing. It is resistant to alcohols and humidity. Once cured, the adhesive will be visco-plastic. For use in medical applications Vitralit® 7311 is currently being tested according to USP Class VI and DIN ISO 10993-4/-5 standards.

Vitralit® 7311 cures in seconds with ultraviolet or visible light. For excellent curing results high intensity LEDs at 405 nm wavelength are recom-mended. This wavelength also permits the bonding of UV blocked materials like polycarbonate. Vitralit® 7311, as an example, can be utilized for needle bonding in medical device manufacturing. Cured with a Bluepoint LED eco light source from UV manufacturer Hönle,  Vitralit® 7311 achieves high bond strength in less than a second, providing reliable and durable bonds.


Vitralit® UV 4050 MV
Colle à usage Médical

New UV-adhesive for plastic bonds

Eleco presents a new adhesive from Panacol's successful Vitralit® UV 4050s series: Vitralit® UV 4050 MV features medium viscosity and is best suited for bonding plastics, especially for medtech applications.

With 450 to 650 mPas Vitralit® UV 4050 MV is of medium viscosity. When cured it shows a very good flexibility and an excellent stability. This transparent adhesive has a very low shrinkage of only 2%.
The newly developed adhesive provides excellent adhesion to most plastics like PVC, ABS, SAN and PC, as well as to stainless steel and glass. If at least one assembly material is transparent, Vitralit® UV 4050 MV will cure very quickly to produce a strong and reliable bond. UV blocked materials like polycarbonate can be cured thanks to the adhesive’s ability to cure with visible light (>400nm).
Vitralit® UV 4050 MV cures in seconds with UV-A and visible light. Both gas discharge lamps and LEDs are suitable to use for curing. Excellent curing results were achieved with LED lights with a wavelength of 405 nm. Vitralit® UV 4050 MV is currently being tested according to USP Class VI and DIN ISO 10993-4/-5 standards for use in medical applications.


Jetting Elecolit®
Elecolit colle conductrice

New jettable conductive adhesives

Panacol recently expanded its Elecolit®-product portfolio. Thanks to new, innovative filling materials and optimized hardener systems, newly developed adhesives with improved conductivity are now available. For maximimum processing speed, these adhesives can be applied by jetting. New hardener systems in many of the one part epoxy based adhesives develop cure within minutes.

The new Elecolit® silver filled adhesives are available in a range of viscosities to accommodate various applications and requirements. As the conductivity is strongly dependent on the content of conductive filler, Panacol uses uniquely shaped filling materials to achieve an optimal fill ratio. This ensures high conductivity and consistent product performance.